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These are 3x5 cards, the copper foil is 1 thousandth thick and the footprint of the copper foil (minus any cutouts is about 2.5x4.5 inches. The 3x5 cards are about 8 thousandths, the paper layer is about 4 thousandths. So distance between plates is 4, 8, and 16 thousandths.
There will be a 2x2 inch area with 4 thousandth diameter holes centered every 8 thosandths or 250x250 holes or 62,500 holes.
The thickness of the final stack is between 45 and 55 thousandths, the layers are bonded together fairly well and there are no shorts between plates in either piece.
The interplate capacitances are 0.00233uF, 0.0022uF and 0.00107uF in both. I'm confused as to why the first two are so similar, it may be that I didn't clamp them hard enough (so the plate to plate distances are 8,8,16 because of this.

40x40 holes (approx) or 1600 holes in a 2x2" region

not really cleanly done, but there are currently no shorts between layers (anymore) so I'm hopeful I'll be able to make a breeze.